According to People's Daily, the first 12 inches chemical mechanical polishing machine developed by Tsinghua University was delivered and put into use recently, which marked a step forward in localization of the high-end integrated circuit equipment.　

The chemical mechanical polishing machine uses chemical and mechanical effects to polish the wafer to obtain a smooth surface of the nano-level, which is one of the five key technologies in the integrated circuit fabrication process.

The main technical indicators of the china-made chemical mechanical polishing machine have reached or exceeded the top level of the world.